Signal Integrity Issues and Printed Circuit Board Design ebook
Par brown linda le lundi, août 8 2016, 06:16 - Lien permanent
Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks
Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks ebook
Format: djvu
ISBN: 013141884X, 9780131418844
Page: 409
Publisher: Prentice Hall International
For backplane designs, the most common form of Smaller vias and tighter pitch driven by large pin count BGA packages makes back-drilling impractical in these applications; due to drill bit size and tolerance issues. A successful high-speed PCB must effectively integrate high speed ASIC's and other components to optimize signal integrity. Until relatively recent times digital PCB design (and especially when prototyping) could be viewed as simply a means to electrically interconnect components and unless you designed RF circuits there was little else to worry about. HyperLynx PCB Analysis Blog: The HyperLynx team discusses Signal & Power Integrity issues in today's digital designs. However the PCB itself, or the means of connecting the components used (i.e. Prototyping), is now is a very common cause of a loss of signal integrity. This article presents a brief overview of board level simulation for high-speed, multilayer PCB design and highlights some common traps and some tips so hopefully you get it right first time. Its low dielectric constant and low dissipation factor make it an ideal candidate for broadband circuit designs requiring fast signal speeds or improved signal integrity. They can carry signals or power between layers. Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks The definitive high-speed design resource for every PCB designer In this book, renowned. For example, the attenuation losses of an interface operating at 2.5 Gbits/s are commonly on the order of 0.3 dB per inch of FR4 printed-circuit board (PCB) trace. I know I have to separate analog Others say that it is better if the analog and the digital signals are just running across separate areas, using a common Ground Plane and they also claim that a split Ground Plane causes a lot of signal integrity problems instead of solving them. So although the package and your clock speed have not changed a problem may exist for legacy designs. As increasing data rates reduce available error margin in high-speed systems, engineers need to improve end-to-end signal integrity using design techniques that minimize attenuation, jitter, and impedance. From: "jwages"